They feature high input impedance, wide bandwidth, high slew rate, and low input offset and input bias currents. Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. The D package is available taped and reeled.
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On all other products, production processing does not necessarily include testing of all parameters. They feature high input impedance, wide bandwidth, high slew rate, and low input offset and input bias currents.
The I-suffix devices are characterized for operation from? Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. NC VCC? Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.
Tube of 50 Tube of 25 Tube of 75 Reel of ? Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The magnitude of the input voltage should never exceed the magnitude of the supply voltage or 15 V, whichever is less.
The output may be shorted to ground or to either supply. The package thermal impedance is calculated in accordance with JESD Common-mode input voltage range Maximum peak output voltage swing Large-signal differential voltage amplification Unity-gain bandwidth Input resistance Common-mode rejection ratio Supply-voltage rejection ratio?
All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure Pulse techniques are used to maintain the junction temperature as close to the ambient temperature as possible. All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified.
All characteristics are measured under open-loop conditions, with zero common-mode voltage, unless otherwise specified. VI VI Figure 1. Unity-Gain Amplifier Figure 2. Gain-of Inverting Amplifier IN? Figure 3. Maximum Peak Output Voltage?
Supply Voltage? V VOM? Load Resistance? Hz 1M 10 M Figure 6 Figure 7? Data at high and low temperatures are applicable only within the specified operating free-air temperature ranges of the various devices.
See Figure 2? Free-Air Temperature? Differential Voltage Amplification? Large-Signal Differential Voltage Amplification? Supply Current? Common-Mode Rejection Ratio? Total Power Dissipation?
Input Bias Current? Equivalent Input Noise Voltage? Output Voltage? Elapsed Time? R3 C2? Input A 16 TL k? Figure Output 1 M? F k? Audio-Distribution Amplifier 10 k? N1 k? Output Figure AC Amplifier 10 k?
F Figure Output k? Input ? Balance 10 pF 75? Hz 10 k? MIN k? Bass MAX 0. F MIN k? Treble MAX 10 k? Gain Figure Min Treble 10 k 20 k 0.
Output 0. F VCC? NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All linear dimensions are in inches millimeters. This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. This package can be hermetically sealed with a metal lid. The terminals are gold plated. All linear dimensions are in millimeters. Body dimensions do not include mold flash or protrusion not to exceed 0, Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components.
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